Hoffman Materials accurately and efficiently cut and process a wide range of materials, including Quartz, Silicon, Sapphire, Ruby, Lithium Tantalate, Lithium Niobates, as well as other emerging and less well known materials.

HM orient, slice, grind, lap, polish, and finish materials to customers exacting specifications. Their wire saws accurately cut a variety of thickness down to about 200 microns, and as required, can accurately dimension and finish materials using their full complement of cutting, lapping, and polishing services.

SAW Wafers - Manufactured from premium, single crystal quartz stones

Langersite Crystal

For further information please contact us